1. What is Gross Die Per Wafer?

Gross Die Per Wafer (GDPW) is a calculation used in semiconductor manufacturing to estimate the number of complete dies that can be produced from a single silicon wafer. It's an important metric for cost estimation and production planning.

2. How Does the Calculator Work?

The calculator uses the GDPW formula:

Where:

• \( d \) — Wafer diameter (mm)
• \( A \) — Die area (mm²)

Explanation: The formula calculates the wafer area using the circle area formula and divides it by the area of a single die to estimate the maximum number of complete dies.

3. Importance of GDPW Calculation

Details: Accurate GDPW estimation is crucial for semiconductor manufacturing cost analysis, production yield prediction, and capacity planning.

4. Using the Calculator

Tips: Enter wafer diameter in millimeters and die area in square millimeters. Both values must be positive numbers.

5. Frequently Asked Questions (FAQ)

Q1: Does this calculation account for wafer edge loss?
A: No, this is a theoretical maximum. Actual die count will be lower due to edge loss, defects, and other manufacturing factors.

Q2: What are typical wafer diameters?
A: Common wafer sizes include 150mm, 200mm, and 300mm diameters, with 300mm being the current industry standard.

Q3: How accurate is this calculation?
A: This provides a theoretical maximum. Actual yield depends on many factors including die shape, wafer flat/notch, and manufacturing defects.

Q4: Should die scribe lines be included in the area?
A: Typically, the die area (A) should include both the active die area and the scribe line area between dies.

Q5: How does die shape affect the calculation?
A: This formula assumes optimal rectangular die packing, which is rarely perfect in practice. Actual die count may vary based on die aspect ratio.